ARQUIMEA will participate in the project EFESOS, part of the Horizon 2020 Programme funded by the European Commission

EFESOS (Evaluation of 22nm Fully-dEpleted Silicon-On-insulator technology for Space) develops a microelectronic platform for the design of integrated circuits for Space.

The objective of the project is the development and validation of a cutting-edge microelectronics technology platform for rad-hard applications using the advanced 22FDX technology from the company Global Foundries. ARQUIMEA will design three complex high-performance integrated circuits for space and high reliability applications.

The 22FDX technology offers better performance than other microelectronic processes normally used for space, such as low consumption, intrinsic resistance to radiation, increased integration capacity and optimized cost. Therefore, it is specifically demanded in critical applications.

The technology platform will also allow the development of high-reliability, high-speed data-processing ICs to be used in critical terrestrial applications such as autonomous vehicles, 5G communications, quantum computing, medical technology, IoT or artificial intelligence.

EFESOS meets the growing demand by the space industry for fundamental technologies that enhance the development of more integrated equipment and systems, with better features and higher performance. The project contributes greatly to the strategic objective of the European Union (EU) to achieve non-dependence on critical technologies in the space sector. With EFESOS, ARQUIMEA is at the state-of-the-art of space microelectronics.

The project is led by the Belgian research center IMEC, and the rest of the team is formed by RUAG Space, a leading European organization in the aerospace and defense sector, and MICROTEST, an Italian company specialized in test of electronic components.

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